Intel has revised the construction schedule for its Ohio One semiconductor manufacturing site in New Albany, Licking County, delaying its launch to the next decade. The first phase (Mod 1) will now be completed in 2030, with production starting between 2030 and 2031. Mod 2 is set to finish in 2031, with operations launching in 2032. The company is slowing down the facility's construction to align its investments with market conditions. However, Intel stressed that it could accelerate construction if needed.
Intel originally planned to complete the first phase of its Ohio site — once called the Silicon Heartland — in 2025. However, massive investments amid uncertain demand made Intel push the completion of the first module to 2027 or 2028. Now, the company believes it will need its fabs in Ohio only in 2030 and beyond. The delay suggests that it does not expect demand for its production capacity to skyrocket soon, which may be a not-so-positive development. On the other hand, Intel will also not have to invest heavily in its Ohio site now, which is good news for the company's balance sheet as it is struggling to return to profitability. Investments in production equipment are the most significant investments in semiconductor fabrication facilities, so by delaying them, Intel significantly cuts its capital expenditures for the 2025 – 2028 period.
