Intel held its inaugural Intel Foundry Services Direct Connect event today. It essentially marks the launch of Intel's new manufacturing strategy, bringing all of its customer manufacturing, system design, packaging and connectivity solutions under one umbrella.
During the event, Intel outlined its new process roadmap which included the announcement of its 14A node. It's estimated to hit the market in 2026 or 2027 and marks the first node to make use of High-NA lithography. It's expected to incorporate PowerVia backside power delivery and RibbonFET GAA transistors. Suffice to say, this stuff is bleeding edge.
