
Intel and the U.S. government on Tuesday officially inked funding deal. Intel will get up to $7.86 billion in funding from the U.S. Department of Commerce under the CHIPS and Science Act as well as get a $3 billion contract under the Secure Enclave program from the Department of Defense. The company is also eligible for loan guarantees and a 25% investment tax credits of qualified investment of $100 billion.
The $7.86 billion CHIPS Act funding will be used to support Intel's semiconductor manufacturing and advanced packaging projects in Arizona (where Intel's most advanced Fab 52 and Fab 62 are located), New Mexico (where Intel's most advanced packaging facilities are), Ohio (home for Intel's future fabs), and Oregon (the company's major hub for semiconductor R&D). These projects are central to Intel's plan to build and package chips using leading-edge process technologies in the U.S.