Modular smartphones have come and gone before, but at MWC 2026, Tecno is taking another swing at the idea – and this time, it’s photography that’s firmly in the spotlight.
The brand has unveiled what it calls its Modular Magnetic Interconnection Technology, a concept ecosystem built around an ultra-thin base phone that measures just 4.9mm thick. Instead of bolting on bulky accessories, Tecno's device uses a precision magnetic array and pogo-pin connectors to snap slim, purpose-built modules onto the back of the device.
