Huawei, the company most connected to China’s drive for tech self-sufficiency, unveiled its AI chip plans on Thursday, laying down the product roadmap for a semiconductor division that’s become increasingly important to both the company and to the country more broadly.
On Thursday, Huawei rotating chair Eric Xu revealed the next iterations of the company’s Ascend AI chips. Huawei will release the Ascend 950PR in the first quarter of 2026, followed by the Ascend 950DT at the end of that same year. The Ascend 960 and the Ascend 970 would follow in Q4 2027 and Q4 2028 respectively. Xu noted that all the chips will come with Huawei-designed high-bandwidth memory.
