A high-ranking Huawei executive has reportedly made a rare admission that China’s ambitious semiconductor efforts may have peaked. On June 9, during the Mobile Computility Network Conference in Suzhou, China, Huawei’s Cloud Services CEO Zhang Ping’an voiced concerns about China’s inability to source 3.5nm chips because of U.S. sanctions.
Zhang pointed out that TSMC, based in Taiwan and therefore not subject to the U.S. sanctions, continues to increase its supply of 3.5nm semiconductors. “However, under U.S. sanctions, China has no way to secure these products,” he said.
