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TechRadar
Desire Athow

Here’s the chip that could make 100TB SSDs mainstream in 2024 but you won’t be able to use them

321-layer NAND chip from Hynix

Just two months after it started the mass production of its 238-layer 4D NAND flash memory (announce at Flash Memory Summit 2022), SK Hynix has demoed the first NAND memory with more than 300 layers. At 321-layer, the 1Tb part is twice the size of the 238-layer product and - according to SK Hynix - boosts a 59% improvement in “productivity”. 

It is unclear what Hynix refers to but one can expect that storage density has doubled (i.e. 1Tb to fit where 512Gb), quite a feat for a part that is still a TLC (triple level cell) rather than a QLC (quad level cell) or even PLC (penta level cell).

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