Today, TrendForce shed some light on the future of high bandwidth memory (HBM) technology and HBM4, specifically, which is expected to debut in 2026. This upcoming technology promises to extend its interface to 2048 bits and substantially change the architecture. TrendForce claims that HBM4 will significantly depart from traditional standardized DRAM technologies to more customized solutions.
HBM4 will be the first to use a 12nm logic process technology for its base die, which foundries, not DRAM makers, will now make. This development will be a collaborative effort between foundries and memory suppliers, which essentially means a symbiotic relationship to advance high-speed memory technology. The increased performance and enhanced feature set of HBM4 are tailored to meet the demands of future processors for artificial intelligence (AI) and high-performance computing (HPC) from key industry players such as AMD, Nvidia, and Intel.
