Downed Russian drone used at least 30 chips from Western companies — silicon from Xilinx, TI, Marvell, Micron, and others found in the wreckage

Sukhoi S-70 Okhotnik-B.

A Sukhoi S-70 Okhotnik-B unmanned combat aerial vehicle (UCAV), found crashed behind Ukrainian lines, was built using a plethora of Western chips. The drone included parts from Analog Devices, Fairchild Semiconductor, Infineon, Marvell, Maxim, Micron, ON Semiconductor, STMicroelectronics, Texas Instruments, Xilinx, and more — some of which also produce electronics for the U.S. military.

According to the German news site Golem.de (machine translated), the drone was deliberately shot down by a Russian jet after it went out of control in the Donetsk region, some 16 kilometers behind the frontlines. Ukrainian soldiers then recovered the wreckage and an investigation by Ukraine’s military intelligence service (GUR) revealed these chips and their sources.