Cooler Master showed off its 3D Heatpipe technology back at Computex 2025, and now it's finally coming to the public just a few months later. This quick turnaround time can be attributed to perhaps the ingenious simplicity of this solution. Instead of having the heatpipes only go up against the edges of the heatsink fin stack, another one cuts through the center, allowing for more even heat dissipation — and now Cooler Master is bringing it to its legendary Hyper 212 lineup, as reported by TechPowerUp.
