TAIPEI, May 19, 2026 /PRNewswire/ -- Compal Electronics, Inc. (Compal; TWSE: 2324) will showcase its next-generation integrated AI infrastructure solutions at COMPUTEX 2026, highlighting the company's expanding capabilities across AI servers, liquid cooling, and data center infrastructure integration.
As AI workloads continue driving rapid growth in power density and thermal demands, Compal is expanding beyond traditional server manufacturing to deliver more integrated, deployment-ready AI infrastructure solutions for cloud service providers, enterprises, and large-scale AI factories. Through its collaboration with Exascale Labs, Compal is further strengthening its ability to integrate compute, cooling, and power infrastructure into scalable AI data center deployments tailored to evolving customer requirements.
At COMPUTEX 2026, Compal will present a full AI infrastructure showcase inside its booth, integrating AI servers, liquid cooling, and data center infrastructure technologies. The showcase includes Compal's latest AI server platforms, including OG231-2-L1 and SGX30-2, alongside its Coolant Distribution Unit (CDU) liquid cooling technologies. In collaboration with Exascale Labs, the exhibit will also feature Modular Data Center (MDC) and Solid-State Transformers (SST) based HVDC power architecture technologies, highlighting how integrated compute, cooling, and power infrastructure can help customers accelerate AI deployment while improving scalability and energy efficiency.
