
SK hynix is evaluating Tokyo Electron's (TEL) latest cryogenic etching tools, which operate at -70C temperatures, to enable new flavors of 3D NAND with more than 400 layers. Cryogenic etching tools 'drill holes' three times faster than conventional tools, a capability that will be instrumental for 3D NAND with over 400 active layers, reports The Elec.
Instead of importing the actual equipment to South Korea, SK hynix is sending test wafers to Tokyo Electron labs in Japan. This method enables the 3D NAND maker to effectively assess the technology's potential without shipping actual tools to SK Hynix and installing them into fabs. The new etching system operates at a chilling temperature of -70°C, which is a stark contrast to the 0°C to 30°C range of current etching processes.