Innotron, the parent company of ChangXin Memory Technologies (CXMT), plans to invest $2.4 billion in a new advanced packaging facility in Shanghai. According to Bloomberg, this plant will focus on packaging high-bandwidth memory (HBM) chips and will begin production by mid-2026. Innotron will build the facility using money from various investors, including GigaDevice Semiconductor.
The new facility will concentrate on various advanced packaging technologies, such as interconnecting stacked memory devices using through-silicon vias (TSV), which is crucial for producing HBM. According to the Bloomberg report, the facility is anticipated to have a "packaging capacity of 30,000 units per month."
