The chief executive of SMIC faced criticism for proposing to advance chip packaging technologies and multi-chiplet designs after the company lost access to 7nm and 10nm-capable wafer fab tools due to U.S. sanctions. But his vision has now become central to China's semiconductor approach for 2023, according to DigiTimes. Industry heavyweights like Huawei and government-backed entities with deep pockets are making substantial progress in this domain. Companies like JCET and Tongfu already offer their clients 2.5D and 3D packaging technologies.
Through the National Natural Science Foundation of China (NSFC), the Chinese government is channeling more funds into chiplet research. NSFC's 2023 research areas encompass advanced 2.5D/3D packaging techniques, reusable chiplet design methods, parallel processing for multiple chiplets, electronic design automation (EDA) tools, and comprehensive multi-chiplet simulations. This intensified focus on chiplet technology showcases China's strategy to minimize its dependence on foreign semiconductor innovations.
