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The Economic Times
The Economic Times
Technology

Cadence rolls out AI agent to speed circuit board, chip packaging design

Cadence Design Systems on Wednesday launched ​an artificial-intelligence "super agent" that ​designs printed circuit boards and chip packages, extending the company's ​push to automate more of the engineering process.

The tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work ‌using Cadence's ⁠existing ⁠software tools to lay out and virtually test circuit designs. Cadence said Nvidia ​chips will accelerate the AI work.

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