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Jabran Kundi

Broadcom’s Hock Tan Says AI’s Next Bottleneck Isn’t Chips, Power, or Memory. It’s Not a Tech Problem at All.

Chips, memory, and power have been at the center of debates over AI infrastructure bottlenecks. But Broadcom (AVGO) CEO Hock Tan believes the next major constraint could be money. Speaking at the DBS Asia Future Forward Conference in Singapore, he suggested that access to financing could constrain AI development more than shortages of hardware or electricity.

Tan expects supply constraints to ease, pointing to the pattern of shortages that have appeared and subsided over the past two years. He also believes memory tightness will improve within a year as wafer and power constraints also ease. However, demand remains a difficult challenge. According to Tan, the industry still cannot supply all the computing infrastructure customers want, and that imbalance could continue through 2029 or possibly 2030.

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