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Shares of Broadcom (AVGO) have continued to grab attention on Wall Street as the AI infrastructure wave broadens out past GPUs and into semiconductor packaging innovations.
As the latest catalyst, Applied Materials Inc. (AMAT) revealed that Broadcom had become its latest partner under its EPIC platform for developing cutting-edge innovations in AI chip packaging. The collaboration adds further fuel to a burgeoning trend: AI performance is becoming not only a function of computing capabilities, but also efficient interconnects between multiple chips within the system.
