
DigiTimes reported that ASML is mulling the release of a special version of its deep ultraviolet lithography (DUV) tool that will comply with the latest U.S. export rules and that could be shipped to Chinese customers without a license. The device would enable companies like SMIC and Hua Hong to make chips on 28nm-class nodes and thicker, but it will not allow them to use more advanced nodes. However, the company has since denied this report.
Updated (7/6): ASML wrote us a note, saying that the DigiTimes report is incorrect.