ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second

ASML.

ASML this week reaffirmed that it is on track to release a Twinscan NXE extreme ultraviolet lithography system that features a 1000W EUV power source and can process up to 330 wafers per hour. The system, projected for sometime in 2030 or beyond, offers 50% more power than the current best EUV tool, the NXE:3800E. Such machines will greatly increase productivity and decrease costs per wafer for chipmakers, but to make them possible, ASML has had to achieve several breakthroughs.

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