
Amkor Technology has confirmed it will build a $2 billion advanced packaging and test facility on a 104-acre site in Peoria, Arizona, with construction beginning imminently and production expected in early 2028. The revised plan, approved by the Peoria City Council on August 29, swaps out Amkor’s originally designated plot in nearby Vistancia for a significantly larger parcel in the city’s Innovation Core.
Why the switch? Because the stakes have changed. Amkor’s facility is arguably the most ambitious U.S.-sited outsourced semiconductor packaging operation ever announced, and the clearest signal yet that the back end of the supply chain is finally catching up to America’s fab frenzy.