SK Hynix has broken ground on a more than $4 billion advanced packaging facility in Indiana that will become its first U.S. production base for high-bandwidth memory, the chips increasingly critical to artificial intelligence systems.
The South Korean memory maker held a ceremony Thursday in West Lafayette, where CEO Kwak Noh-Jung said the facility would help turn Indiana into a key U.S. HBM production hub by 2030. The plant's first cleanroom is scheduled to open in October 2028, with mass production of next-generation HBM expected to begin in the second half of 2029, according to the company.
