Rigid plastic packaging company Mold-Tek Packaging and civil and mechanical engineering firm Mold-Tek Technologies on Friday announced that their respective board of directors will consider a bonus issue of shares for its shareholders, along with dividends during their meeting scheduled for August 26 (Wednesday).
In separate exchange filings, the two companies said their respective boards will also decide the date and time of the Annual General Meetings (AGMs), along with the record date for determining shareholders eligible to participate in the meetings.
